Native Engineering

Printed Circuit Boards (PCBs) are the foundation of nearly every electronic system. Whether it’s a consumer wearable, a satellite communication system, or an electric vehicle powertrain, PCBs define how signals are routed, how components interact, and ultimately, how reliable the product will be. Over the past decade, PCB design has evolved from relatively simple layouts into complex, multi-layer, high-density systems that must simultaneously meet electrical, thermal, and mechanical requirements. As we step into 2025, the PCB industry is undergoing another phase of transformation. Market drivers such as miniaturization, sustainability, and high-frequency data transmission are shaping how engineers approach board design. In this article, we explore the key emerging trends in PCB design for 2025  and their implications for engineers and manufacturers. 1. Miniaturization and High-Density Interconnect (HDI) PCBs The push toward compact electronics with higher performance has made ...